Google has confirmed that the Tensor G6 processor inside its upcoming Pixel 11 series smartphones relies on TSMC’s 3nm manufacturing process, according to a revelation from Google’s VP of Hardware, Peng Yu-Chun. Google’s hardware leadership clarified that the Tensor G6 maintains the same 3nm process used by the previous generation Tensor G5.
Tensor G6 Hardware Specifications and Performance Claims
Despite staying on a 3nm architecture, Google reports notable performance leaps for the Tensor G6 compared to its predecessor. According to Google, the new silicon delivers 50% more TPU compute capacity alongside an upgraded CPU architecture that yields up to 30% better power efficiency than the Tensor G5. Real-world performance benefits will remain unconfirmed until independent testing of the Pixel 11 hardware takes place.
Lineup Details for the Pixel 11 Generation
Frequently Asked Questions
Is the Tensor G6 a 2nm chip?
No. According to Google’s VP of Hardware, Peng Yu-Chun, the Tensor G6 is built on TSMC’s 3nm process, matching the manufacturing node of the previous year’s Tensor G5.
Which smartphones are included in the Pixel 11 series?
The series includes four models: the Pixel 11, Pixel 11 Pro, Pixel 11 Pro XL, and Pixel 11 Pro Fold.
What performance improvements does Google claim for the Tensor G6?
Google states that the Tensor G6 offers 50% more TPU compute and up to 30% better power efficiency from its upgraded CPU compared to the Tensor G5.
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